Heat-dissipating filler large particle zinc oxide "LPZINC"
High thermal conductivity and low thermal expansion coefficient, as well as being soft and gentle on mixing and molding equipment, oxide heat dissipation filler!
In recent years, the demand for thermal management in the field of electronic components has increased, and metal oxides such as alumina, magnesia, and zinc oxide, as well as nitrides like aluminum nitride, are widely used as thermal conductive fillers. Among these, zinc oxide has attracted attention due to its excellent thermal properties and its relatively low Mohs hardness compared to alumina, making it softer. Our company offers multiple grades with different particle sizes in two categories: conventional particles and spherical particles. Based on our long-established technology for controlling particle shape and surface treatment of inorganic compounds, we provide solutions for thermal management, including the highest density packing.
- 企業：堺化学工業
- 価格：Other
